EXEL develops and produces modules with C.O.B. technology (Chip on board) and M.C.M. (Multichip module) for customers and exclusive products.
C.O.B. technology it is suitable for those applications where the reduction in size is a primary specification, together with the reduction in consumption and production costs.
The M.C.M. can be used for high-density component modules or complex integrated circuits. In both cases, samples are provided for approval, pre-production and mass production.
Small and medium productions are also made.
Thanks to the CO. the die is connected to a conventional FR4 printed circuit board or other material.
Subsequently, the chip is bonded and finally covered with resin.
Thanks to the C.O.B. technology it is possible to use many chips normally used in packages such as BGA, QFP, SOIC, and to mount the silicon directly on the support of the standard printed card with a considerable saving with regard to large productions.